Kudom Product Tour Vol.1 | Practical Applications of KSID & KYRT in Semiconductor Wafer Fabrication and Advanced Packaging

Semiconductor manufacturing represents the pinnacle of human industrial technology. The fabrication of nanometer-scale chips demands extreme precision in temperature, pressure and timing control. From monocrystalline silicon ingot growth and wafer dicing to photolithography, etching, thin-film deposition and final packaging & testing, every process step relies on ultra-stable and reliable power control. Even the slightest power fluctuation can render an entire batch of wafers defective. At the advanced 3nm process node, a single 12-inch wafer is worth over US$100,000, and a single equipment malfunction may incur losses exceeding millions of US dollars.

Kudom’s KSID series dual-channel solid state relays (SSRs) and KYRT series three-phase power regulators are engineered for harsh industrial operating conditions. They deliver critical power control throughout the full semiconductor manufacturing workflow, acting as the "invisible guardians" inside chip fabs. Below are real-world application cases of Kudom products in commercial operations:

Monocrystalline silicon ingot growth marks the starting point of the semiconductor industrial chain, and also stands as one of the most temperature-sensitive processes. At a high temperature of 1,420°C, a mere 1°C fluctuation in silicon melt temperature will directly compromise the uniformity of crystal resistivity and raise defect density, ultimately scrapping the entire silicon ingot.

The KYRT series three-phase power regulators adopt phase-shift control technology optimized for resistive loads. They accept three standard control signal inputs: 0–5 VDC, 0–10 VDC and 4–20 mA, and automatically adapt to load frequency variations ranging from 45 Hz to 60 Hz. Two operation modes are available for loads with or without neutral wire connection. When integrated with high-precision PID temperature controllers and Class A platinum resistance temperature detectors (RTDs) in optimized system configurations, KYRT modules enable ultra-precise temperature regulation of molten silicon.

Silicon wafer epitaxial growth requires precise deposition of uniform monocrystalline silicon thin films onto wafer surfaces at elevated temperatures. Built-in RC absorption circuits and MOV surge suppressors are incorporated into KYRT series modules, complying with IEC61000-4-4 electrical fast transient immunity (2 kV / 100 kHz) and IEC61000-4-5 surge immunity standards (2 kV common-mode / 1 kV differential-mode). These features effectively suppress grid voltage fluctuations and instantaneous voltage spikes, stabilizing the reproducibility of epitaxial furnace temperature profiles and laying a solid foundation for subsequent chip manufacturing processes.

Diffusion and annealing are core processes that modify the electrical properties of semiconductors. In diffusion furnaces, wafers are held at 800–1,200°C for several hours to enable uniform diffusion of dopant atoms into silicon substrates. Rapid thermal annealing (RTA), by contrast, heats wafers above 1,000°C within seconds followed by rapid cooling to activate dopants and repair lattice damage.

The KSID series dual-channel solid state relays feature an internal SCR anti-parallel structure, supporting either zero-cross or random-phase triggering modes to match diverse process requirements. Its integrated dual-channel design replaces multiple single-channel SSRs, significantly saving cabinet space. Within semiconductor fabs where floor space carries premium costs, every square meter saved translates to higher production capacity and lower operational overhead.

KSID series delivers 4,000 Vrms input-to-output dielectric withstand voltage and insulation resistance of 1,000 MΩ @ 500 VDC, enabling stable operation in cleanroom environments with severe electromagnetic interference (EMI). This consistent performance preserves identical temperature profiles for diffusion and rapid thermal annealing furnaces across different batches and wafers, boosting uniformity in chip electrical performance and overall production yield.

At advanced process nodes of 7 nm and below, plasma etching and thin-film deposition demand atomic-level precision. Plasma etchers generate stable plasma under high vacuum to perform nanoscale microfabrication on wafer surfaces, while CVD/PVD deposition equipment precisely modulates process gas flow and temperature to deposit uniform multilayer thin films on wafers.

The contactless switching design of Kudom KSID solid state relays completely eliminates electric arcs and contact bounce inherent to traditional mechanical switches, preventing electromagnetic interference that disrupts precision control systems. With millisecond-level response speed, KSID instantly executes commands from control systems to accurately regulate heating assemblies and vacuum pumps.

Furthermore, all KYRT models withstand surge current shocks of 300–1,250 A for 10 ms, while all KSID models sustain surge currents of 300–500 A for 10 ms. They easily handle instantaneous high inrush currents generated during vacuum pump startup and plasma ignition, maintaining high equipment reliability and stability under non-stop 24/7 operation.

Driven by the rapid advancement of AI chips and high-performance computing (HPC), advanced packaging technologies including CoWoS and 2.5D/3D heterogeneous integration have become industry hotspots. In advanced packaging workflows, die bonders, wire bonders and flip-chip bonders align dozens or even hundreds of dies and HBM memory stacks with micrometer-level precision. Tiny vibrations or temperature deviations will cause die alignment offsets, degrading finished device performance and production yield.

KSID series SSRs and KYRT series power regulators also play vital roles in advanced packaging equipment. For temperature control of heating stages in die bonders, KYRT power regulators deliver high-precision thermal management for compact low-inertia heating stages when paired with high-accuracy temperature sensors and high-performance PID controllers under standard laboratory test conditions, facilitating uniform melting and curing of solder paste or conductive adhesive. For thermal control systems in wire bonders, KSID solid state relays leverage high-frequency switching performance and exceptional reliability to improve consistency and quality for every bonding cycle.

Amid the global restructuring of the semiconductor industrial chain, domestic substitution of semiconductor equipment has risen as a national strategic priority. As a leading Chinese manufacturer of solid state relays, Kudom Electronics leverages years of technical accumulation and product innovation to establish supply chain partnerships with numerous domestic semiconductor equipment manufacturers.

When benchmarked against imported brands, Kudom products match international standards in core performance metrics while offering shorter lead times, cost advantages and rapid-response technical support. Kudom Electronics also provides customized products and system solutions tailored to unique customer requirements, helping domestic semiconductor equipment manufacturers cut costs, shorten R&D cycles and strengthen market competitiveness.